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TPA6111A2DGNR

TPA6111A2DGNR

Manufacturer Part:TPA6111A2DGNR
Part Type:RF Semiconductors & Modules
Manufacturer:TI
Part ID:TPA6111A2DGNR
Date Code:
Quantity Available:7604
Last Updated:2024/11/26

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Description

Features

Applications

TPA6111A2DGNR Description

    Note 2: All input and/or output pins shall not exceed VCC + 0.5V and shall not exceed the absolute maximum rating at any time, including power-up and power-down. This prevents the ESD structure from being damaged due to excessive currents flowing from the input and/or output pins to QV CC and VCC. There is a diode between each input and/or output to VCC which is forward biased when incorrect sequencing is applied. LI and Bn pins do not have power sequencing requirements with re- spect to V CC and QVCC.

TPA6111A2DGNR Features

    † The PW package is available taped and reeled. Add R suffix to device type (e.g. TPA6111A2DGNRPWR) to order quantities of 2,000 devices per   reel. Bulk quantities are 70 units per tube. ‡ The TSSOP-20 (PW) package uses Pb-free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255C to 260C peak reflow  temperature and compatible with either lead free or Sn/Pb soldering operations.

TPA6111A2DGNR Applicatioins

    Technical/Catalog InformationTPA6111A2DGNRVendorTexas InstrumentsCategoryIntegrated Circuits (ICs) Package / Case
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